Rogers 6010 PCB DK10.2 Substrate 50mil With Immersion Gold for Satellite Communications Systems
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RT/duroid 6010LM microwave laminates are high-performance ceramic-filled PTFE (polytetrafluoroethylene) composites specifically designed for electronic and microwave circuit applications that require a high dielectric constant. These laminates offer several advantages in terms of electrical and mechanical properties, making them suitable for a wide range of applications.
PCB Capability (RT/duroid 6010)
| PCB Material: | Ceramic-PTFE composite |
| Designator: | RT/duroid 6010LM |
| Dielectric constant: | 10.2 ±0.25 (process) |
| 10.7 (design) |
| Layer count: | 1 Layer, 2 Layer |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 25mil (0.635mm) |
| 50mil (1.27mm), 75mil (1.90mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, OSP. |
Key Features:
1.High Dielectric Constant: The RT/duroid 6010LM laminate is available with a dielectric constant (Dk) value of 10.2 at 10 GHz. This high Dk value makes it suitable for miniaturizing electronic components and enhancing the performance of microwave circuits.
2.Low Loss Tangent: The laminates exhibit a low loss tangent, ensuring minimal signal loss and maintaining the integrity of high-frequency signals.
3.Thermal Stability: RT/duroid 6010LM laminates offer excellent thermal stability, with a low coefficient of thermal expansion (CTE) that matches copper. This ensures a stable electrical performance even under varying temperature conditions.
4.Dimensional Stability: These laminates provide excellent dimensional stability, enabling precise alignment of multi-layer circuits and reducing the risk of warping or distortion.
5.Ease of Fabrication: RT/duroid 6010LM laminates can be easily machined, drilled, and plated, making them compatible with standard PCB fabrication processes.
| Features and Benefits |
| 1. High dielectric constant for circuit size reduction |
| 2. Low loss. Ideal for operating at X-bank or below |
| 3. Low moisture absorption reducing effects of moisture on electrical loss |
| 4. Low Z-axis expansion providing reliable PTH in multilayer boards |
| 4. Tight DK and thickness control for repeatable circuit performance |
Applications:
Rogers RT/duroid 6010LM laminates are widely used in various electronic and microwave circuit applications, including:
- Patch antennas for wireless communication systems
- Power amplifiers and filters for telecommunications
- Radar systems and microwave sensors
- Phased array antennas
- Microwave components for aerospace and defense industries
Overall, Rogers RT/duroid 6010LM microwave laminates provide an excellent material choice for applications requiring a high dielectric constant, low loss tangent, and superior thermal and dimensional stability.
Appendix1: Properties of RT/duroid 6010LM laminates.
| RT/duroid 6010 Typical Value |
| Property | RT/duroid 6010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.25 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped stripline |
| Dielectric Constant,εDesign | 10.7 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0023 | Z | | 10 GHz/A | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -425 | Z | ppm/℃ | -50℃-170℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 5 x 105 | | Mohm.cm | A | IPC 2.5.17.1 |
| Surface Resistivity | 5 x 106 | | Mohm | A | IPC 2.5.17.1 |
| Tensile Properties | ASTM D638 (0.1/min. strain rate) |
| Young's Modulus | 931(135) 559(81) | X Y | MPa(kpsi) | A |
| Ultimate Stress | 17(2.4) 13(1.9) | X Y | MPa(kpsi) | A |
| Ultimate Strain | 9 to 15 7 to 14 | X Y | % | A |
| Compressive Properties | | ASTM D695 (0.05/min. strain rate) |
| Young's Modulus | 2144 (311) | Z | MPa(kpsi) | A |
| Ultimate Stress | 47(6.9) | Z | MPa(kpsi) | A |
| Ultimate Strain | 25 | Z | % | |
| Flexural Modulus | 4364 (633) 3751 (544) | X | MPa(kpsi) | A | ASTM D790 |
| Ultimate Stress | 36 (5.2) 32 (4.4) | X Y | MPa(kpsi) | A |
| Deformation under load | 0.26 1.3 | Z Z | % | 24hr/50℃/7MPa 24hr/150℃/7MPa | ASTM D261 |
| Moisture Absorption | 0.01 | | % | D48/50℃ 0.050"(1.27mm) thick | IPC-TM-650 2.6.2.1 |
| Thermal Conductivity | 0.86 | | W/m/k | 80℃ | ASTM C518 |
| Coefficient of Thermal Expansion | 24
24
47 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.41 |
| Td | 500 | | ℃ TGA | | ASTM D3850 |
| Density | 3.1 | | g/cm3 | | ASTM D792 |
| Specific Heat | 1.00(0.239) | | j/g/k
(BTU/ib/OF) | | Calculated |
| Copper Peel | 12.3 (2.1) | | pli (N/mm) | after solder float | IPC-TM-650 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Appendix2: Automatic silkscreen machine
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Rogers 6010 PCB DK10.2 Substrate 50mil With Immersion Gold for Satellite Communications Systems Images
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